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TC1411/TC1411N
1A High-Speed MOSFET Drivers
Features
* Latch-Up Protected: Will Withstand 500 mA Reverse Current * Input Will Withstand Negative Inputs Up to 5V * ESD Protected: 4 kV * High Peak Output Current: 1A * Wide Input Supply Voltage Operating Range: - 4.5V to 16V * High Capacitive Load Drive Capability: - 1000 pF in 25 nsec * Short Delay Time: 30 nsec Typ. * Matched Delay Times * Low Supply Current - With Logic `1' Input: 500 A - With Logic `0' Input: 100 A * Low Output Impedance: 8 * Available in Space-Saving 8-pin MSOP Package * Pinout Same as TC1410/TC1412/TC1413
Description
The TC1411/TC1411N are 1A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. As MOSFET drivers, the TC1411/TC1411N can easily charge a 1000 pF gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET's intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy.
Package Types
8-Pin MSOP/PDIP/SOIC
VDD 1 IN 2 NC 3 GND 4 2 8 VDD VDD 1 IN 2 NC 3 8 VDD 7 OUT 6 OUT 7 OUT 6 OUT 5 GND 2 6,7
Applications
* * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Relay Driver
TC1411
TC1411N
5 GND GND 4 6,7
Inverting NC = No Internal Connection
Non-Inverting
Note:
Duplicate pins must be connected together for proper operation.
(c) 2006 Microchip Technology Inc.
DS21390D-page 1
TC1411/TC1411N
Functional Block Diagram TC1411
Inverting Outputs VDD
300 mV Output
Input Effective Input C = 10 pF 4.7V
Non-Inverting Outputs
TC1411N
GND
DS21390D-page 2
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
1.0 ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND - 5.0V Power Dissipation (TA 70C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range .............. -65C to +150C Maximum Junction Temperature ...................... +150C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 16V. Typical values are measured at TA = +25C, VDD = 16V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance VOH VOL RO VDD - 0.025 -- -- -- -- Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time tR -- -- -- Fall Time tF -- -- -- Delay Time tD1 -- -- -- Delay Time tD2 -- -- -- Power Supply Power Supply Current Note 1: IS -- -- Switching times ensured by design. 0.5 0.1 1.0 0.15 mA VIN = 3V, VDD = 16V VIN = 0V 25 27 29 25 27 29 30 33 35 30 33 35 35 40 40 35 40 40 40 45 45 40 45 45 ns ns ns ns TA = +25C 0C TA +70C -40C TA +85C, Figure 4-1 TA = +25C 0C TA +70C -40C TA +85C, Figure 4-1 TA = +25C, 0C TA +70C -40C TA +85C, Figure 4-1 TA = +25C 0C TA +70C -40C TA +85C, Figure 4-1 IPK IREV -- -- -- -- 8 10 10 1.0 0.5 -- 0.025 11 14 14 -- -- A A V V DC Test DC Test VDD = 16V, IO = 10 mA, TA = +25C 0C TA +70C -40C TA +85C VDD = 16V Duty cycle 2%, t 300 s, VDD = 16V VIH VIL IIN 2.0 -- -1.0 -10 -- -- -- -- -- 0.8 1.0 10 V V A 0V VIN VDD, TA = +25C -40C TA +85C Sym Min Typ Max Units Conditions
(c) 2006 Microchip Technology Inc.
DS21390D-page 3
TC1411/TC1411N
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 16V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC JA JA JA -- -- -- 206 125 155 -- -- -- C/W C/W C/W TA TA TA TJ TA 0 -40 -40 -- -65 -- -- -- -- -- +70 +85 +125 +150 +150 C C C C C Sym Min Typ Max Units Conditions
DS21390D-page 4
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V.
500
TA = +25C
500
VSUPPLY = 16V VIN = 3V
400
400
ISUPPLY (A)
ISUPPLY (A)
VIN = 3V
300
300
200
200
100
VIN = 0V
100
VIN = 0V
0
4
6
8
10
12
14
16
0
-40
-20
0
20
40
60
80
VDD (V)
TEMPERATURE (C)
FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage.
1.6
FIGURE 2-4: vs. Temperature.
1.6
Quiescent Supply Current
TA = +25C
VSUPPLY = 16V
1.5
1.5
VTHRESHOLD (V)
1.4
VTHRESHOLD (V)
VIH
VIH
1.4
1.3
1.3
1.2
VIL
1.2
VIL
1.1
4
6
8
10
12
14
16
1.1
-40
-20
0
20
40
60
80
VDD (V)
TEMPERATURE (C)
FIGURE 2-2: Voltage.
25
Input Threshold vs. Supply
FIGURE 2-5: Temperature.
25
Input Threshold vs.
20
TA = +85C TA = +25C
RDS-ON (Ohms)
20
RDS-ON (Ohms)
15
15
TA = +85C TA = +25C
10
10
TA = -40C
5
5
TA = -40C
04
6
8
10 VDD (V)
12
14
16
0
4
6
8
10 VDD (V)
12
14
16
FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.
FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.
(c) 2006 Microchip Technology Inc.
DS21390D-page 5
TC1411/TC1411N
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 16V.
100
CLOAD = 1000 pF
100
CLOAD = 1000 pF
80
80
tRISE (nsec)
60
tFALL (nsec)
TA = +85C TA = +25C
40
60
TA = +85C TA = +25C
40
20
TA = -40C
20
TA = -40C
12 14 16
0
0
4
6
8
10 VDD (V)
4
6
8
10
12
14
16
VDD (V)
FIGURE 2-7: Voltage.
100
Rise Time vs. Supply
FIGURE 2-10: Voltage.
100
Fall Time vs. Supply
CLOAD = 1000 pF
CLOAD = 1000 pF
80
80
tD1 (nsec)
60
tD2 (nsec)
TA = +85C
60
TA = +85C TA = +25C
TA = +25C
40
40
TA = -40C
20 20
TA = -40C
0
4
6
8
10 VDD (V)
12
14
16
0
4
6
8
10 VDD (V)
12
14
16
FIGURE 2-8: Supply Voltage.
100
Propagation Delay vs.
FIGURE 2-11: Supply Voltage.
36
Propagation Delay vs.
TA = +25C VDD = 16V
TA = +25C VDD = 16V
tRISE
Propagation Delays (nsec)
80
34
tD2
tRISE, tFALL (nsec)
60
32
40
tFALL
30
tD1
20
28
0
26
0
500
1000
1500
2000
2500
3000
3500
0
500
1000
1500
2000
2500
3000
3500
CLOAD (pF)
CLOAD (pF)
FIGURE 2-9: Capacitive Load.
Rise and Fall Times vs.
FIGURE 2-12: Capacitive Load.
Propagation Delays vs.
DS21390D-page 6
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Description Supply input, 4.5V to 16V Control input No connection Ground Ground CMOS push-pull output, common to pin 7 CMOS push-pull output, common to pin 6 Supply input, 4.5V to 16V
Symbol VDD
INPUT
NC GND GND OUTPUT OUTPUT VDD
3.1
Supply Input (VDD)
3.3
CMOS Push-pull Output (OUTPUT)
The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 F is suggested.
The MOSFET driver output is a low impedance, CMOS push-pull style output, capable of driving a capacitive load with 1A peak currents.
3.4
Ground (GND)
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow.
The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return.
3.5
No Connect (NC)
No internal connection.
(c) 2006 Microchip Technology Inc.
DS21390D-page 7
TC1411/TC1411N
4.0 APPLICATION INFORMATION
+5V Input VDD = 16V 0V 4.7 F 1, 8 Input 2 6, 7 Output CL = 1000 pF 0.1 F VDD Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90%
90%
TC1411 TC1411N
+5V Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL 10 nsec 0V VDD Output 0V 10%
Inverting Driver
TC1411
90%
tD1 90% 10%
tR
90% tD2 10%
tF
Non-Inverting Driver
TC1411N
FIGURE 4-1:
Switching Time Test Circuit.
DS21390D-page 8
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead MSOP Example:
XXXXXXX YWWNNN
1411NE 635256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: TC1411 e3 CPA^^256 0635
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN
Example: TC1411C e3 OA^^0635 256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2006 Microchip Technology Inc.
DS21390D-page 9
TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E E1
p D 2 B n 1
c
A
A2
F Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom n p A A2 A1 E E1 D L F c B .016 .030 .000 MIN
L
A1
INCHES NOM 8 MAX MIN
MILLIMETERS* NOM 8 0.65 BSC .043 .037 .006 0.75 0.00 4.90 BSC 3.00 BSC 3.00 BSC .031 8 .009 .016 15 15 0.40 0 0.08 0.22 5 5 0.60 0.95 REF 8 0.23 0.40 15 15 0.80 0.85 1.10 0.95 0.15 MAX
.026 BSC
.033 .193 BSC .118 BSC .118 BSC .024 .037 REF 0 .003 .009 5 5 .006 .012 -
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC Equivalent: MO-187 Drawing No. C04-111
Revised 07-21-05
DS21390D-page 10
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
8-Lead Plastic Dual In-line (PA) - 300 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
MAX Number of Pins Pitch Top to Seating Plane A .140 .170 4.32 Molded Package Thickness .115 .145 3.68 A2 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 8.26 Molded Package Width E1 .240 .250 .260 6.60 Overall Length D .360 .373 .385 9.78 Tip to Seating Plane L .125 .130 .135 3.43 c Lead Thickness .008 .012 .015 0.38 Upper Lead Width B1 .045 .058 .070 1.78 Lower Lead Width B .014 .018 .022 0.56 Overall Row Spacing eB .310 .370 .430 10.92 Mold Draft Angle Top 5 10 15 15 Mold Draft Angle Bottom 5 10 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
Units Dimension Limits n p
MIN
INCHES* NOM 8 .100 .155 .130
MAX
MIN
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
(c) 2006 Microchip Technology Inc.
DS21390D-page 11
TC1411/TC1411N
8-Lead Plastic Small Outline (OA) - Narrow, 150 mil (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E E1
p D 2 B n 1
h 45
c A
A2
L A1
MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff A1 .004 .010 0.25 Overall Width E .228 .244 6.20 Molded Package Width .146 .157 3.99 E1 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 Mold Draft Angle Top 0 15 15 Mold Draft Angle Bottom 0 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
Units Dimension Limits n p
MIN
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
DS21390D-page 12
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
APPENDIX A: REVISION HISTORY
Revision D (September 2006)
* Added -40C to +125C temperature range to Temperature Characteristics table and Product Information System page. * Added disclaimer to package outline drawings.
Revision C (March 2003)
* Added 8-Lead MSOP Package.
Revision B (May 2002)
* Converted TELCOM data sheet for Embedded Control Handbook
Revision A (March 2001)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
DS21390D-page 13
TC1411/TC1411N
NOTES:
DS21390D-page 14
(c) 2006 Microchip Technology Inc.
TC1411/TC1411N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples:
a) b) Device: TC1411: 1 A Single MOSFET Driver, Inverting TC1411N: 1 A Single MOSFET Driver, Non-Inverting C E V = = = 0C to +70C -40C to +85C -40C to +125C c) TC1411COA: TC1411CPA: TC1411EUA713: 1A Single MOSFET driver, 8LD SOIC pkg, 0C to +70C. 1A Single MOSFET driver, 8LD PDIP package, 0C to +70C. Tape and Reel, 1A Single MOSFET driver, 8LD MSOP package, -40C to +85C. Tape and Reel, 1A Single MOSFET driver, 8LD SOIC pkg, -40C to +125C. 1A Single MOSFET driver, 8LD PDIP package, 0C to +70C. 1A Single MOSFET driver, 8LD PDIP package, -40C to +85C. 1A Single MOSFET driver, 8LD MSOP package, -40C to +85C. 1A Single MOSFET driver, 8LD PDIP package, -40C to +125C
Temperature Range:
d)
TC1411VOA713:
Package:
OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-Temp.
a) b) c) d)
TC1411NCPA: TC1411NEPA: TC1411NEUA: TC1411NVPA:
(c) 2006 Microchip Technology Inc.
DS21390D-page 15
TC1411/TC1411N
NOTES:
DS21390D-page 16
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
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Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21390D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
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India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-3910 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
08/29/06
DS21390D-page 18
(c) 2006 Microchip Technology Inc.

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